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尹 斓
助理教授

电子邮箱:lanyin@tsinghua.edu.cn
办公地址:乐鱼全站app逸夫技术科学楼B819房间
课题组主页:http://yinlanthu.wixsite.com/lanyin-tsinghua

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  • 教育背景
  • 工作履历
  • 研究领域
  • 奖励与荣誉
  • 学术成果


2007/08-2011/01 美国卡内基梅隆大学材料科学与工程系,博士,导师:Prof. Sridhar Seetharaman

2003/08-2007/07 乐鱼全站app材料科学与工程系,学士

2015/12-至今 乐鱼全站app,助理教授

2012/05-2015/10 伊利诺伊大学厄巴纳香槟分校,博士后,合作导师:Prof. John A. Rogers

2011/02-2012/04 麻省理工学院,博士后,合作导师:Prof. Donald R. Sadoway


探索材料科学、物理化学以及微电子学等领域的基本问题,发掘材料在环境、新能源、以及生物医用方向的新型应用。目前主要的研究方向包括:(1)新型可降解电子器件。器件在人体内完成任务后,可以自然、安全地‘消失’,从而避免了二次移除手术。这种生物相容、可降解的电子器件将在生物医用领域开辟全新的道路;(2)大规模储能电池。风能、太阳能等能源固有的间歇性,是阻碍可再生能源发展的瓶颈,而解决这一重要问题的关键,则是发展大规模储能技术,大规模储能技术是近年来国内外的热点问题,市场潜力巨大。熔盐电池以其廉价的成本优势,将有希望成为主要的大规模储能技术之一,在电网调峰、调频、系统备用、可再生能源对接电网、以及分布式发电和微电网等方面发挥重要的作用。一系列代表性成果在Nature、Advanced Materials、Advanced Functional Materials等权威杂志上发表并被选为封面和亮点文章,多次参加Gordon-Kenan Seminar, TMS, MRS 等学术会议,受到国际同行和媒体的高度评价。


2014年MRS秋季会议奖学金

2010年卡内基梅隆大学会议奖学金

2007年卡内基梅隆大学工学院奖学金

2006年乐鱼全站app三星奖学金

2005年乐鱼全站app奖学金

2004年乐鱼全站app茅台奖学金


1. S.-K. Kang, G. Park, K. Kim, S.-W. Hwang, H. Cheng, J. Shin, S. Chung, M. Kim, L. Yin, J. Chul Lee, K.-M. Lee and J.A. Rogers, “Dissolution Chemistry and Biocompatibility of Silicon- and Germanium-Based Semiconductors for Transient Electronics”, ACS Appl. Mater. Inter. 7, 2015, p9297-9305.

2. L. Yin, A.B. Farimani, K. Min, N. Vishal, J. Lam, Y.K. Lee, N.R. Aluru and J.A. Rogers, “Mechanisms for Hydrolysis of Silicon Nanomembranes as Used in Bioresorbable Electronics”, Adv. Mater. 27, 2015, p1857-1864.

3. C.H. Lee, J.-W. Jeong, Y. Liu, Y. Zhang, Y. Shi, S.-K. Kang, J. Kim, J.S. Kim, N.Y. Lee, B.H. Kim, K.-I. Jang, L. Yin, M.K. Kim, A. Banks, U. Paik, Y. Huang and J.A. Rogers, “Materials and Wireless Microfluidic Systems for Electronics Capable of Chemical Dissolution on Demand”, Adv. Funct. Mater. 25, 2015, p1338-1343.

4. L. Yin, C. Bozler, D.V. Harburg, F. Omenetto and J.A. Rogers, “Materials and Fabrication Sequences for Water Soluble Silicon Integrated Circuits at the 90 nm Node”, Appl. Phys. Lett. 106, 2015, 014105. doi: 10.1063/1.4905321.

5. L. Yin, X. Huang, H. Xu, Y. Zhang, J. Lam, J. Cheng, J.A. Rogers, “Materials, Designs and Operational Characteristics for Fully Biodegradable Primary Batteries”, Adv. Mater. 26(23), 2014, p3879-3884, Frontcover.

6. S.-W., Hwang, G. Park, H. Cheng, J.-K. Song, S.-K. Kang, L. Yin, J.-H. Kim, F.G. Omennetto, Y. Huang, K.-M. Lee and J.A. Rogers, “Materials for high performance biodegradable semiconductor devices”, Invited paper, Adv. Mater. 26(13), 2014, p1992-2000, Frontcover

7. Y. Zhang, S. Wang, X. Li, J.A. Fan, S. Xu, Y.-M. Song, K.-J. Choi, W.-H. Yeo, W. Lee, S.N. Nazaar, B. Lu, L. Yin, K.-C. Hwang, J.A. Rogers and Y. Huang, “Experimental and theoretical studies of serpentine microstructures bonded to prestrained elastomers for stretchable electronics”, Adv. Funct. Mater. 24(14), 2014, p2028-2037.

8. L. Yin, H. Cheng, S. Mao, R. Haasch, Y. Liu, X. Xie, S.-W Hwang, H. Jain, S.-K. Kang, Y. Su, R. Li, Y. Huang and J.A. Rogers, “Dissolvable metals for transient electronics”, Adv. Funct. Mater. 24(5), 2014, p645-658, Frontispiece.

9. A. Allanore, L. Yin and D.R. Sadoway, “A new anode material for oxygen evolution in molten oxide electrolysis”, Nature, 497, 2013, p353-356.

10. R. Li, H. Cheng, Y. Su, S.-W. Hwang, L. Yin, H. Tao, M.A. Brenckle, D. Kim, F.G. Omenetto, J.A. Rogers and Y. Huang, “An analytical model of reactive diffusion for transient electronics”, Adv. Funct. Mater.Vol. 23(24), 2013, p3106-3114.

11. L. Yin, E. Sampson, J. Nakano and S. Sridhar, “The effects of nickel/tin ratio on Cu induced surface hot shortness in Fe”, Oxid. Met. Vol. 76(5), 2011, p367-383.

12. L. Yin and S. Sridhar, “Effects of residual elements arsenic, antimony, and tin on surface hot shortness”, Metall. Mater. Trans. B Vol. 42(5), 2011, p1031-1043.

13. L. Yin and S. Sridhar, “Effects of small additions of tin on high temperature oxidation of Fe-Cu-Sn alloys for surface hot shortness”, Metall. Mater. Trans. B Vol. 41(5), 2010, p1095-1107.

14. L. Yin, S. Balaji and S. Sridhar, “Effects of nickel on the oxide/metal interface morphology and oxidation rate during high-temperature oxidation of Fe–Cu–Ni Alloys”, Metall. Mater. Trans. B Vol. 41(3), 2010, p598-611.

15. L. Yin, S. Balaji and S. Sridhar, “Effects of nickel on interface morphology during oxidation of Fe-Cu-Ni Alloys”, Defect and Diffusion Forum, Vol. 297-301, 2010, p 318-329.

16. B. Webler, L. Yin and S. Sridhar, “Effects of small additions of copper and copper + nickel on the oxidation behavior of iron”, Metall. Mater. Trans. B Vol. 39(5), 2008, p725-737.


     


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